Moldova standards PDF
Mechanical standardization of semiconductor devices - Part 6-10- General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON. IEC 60191-6-10:2003. Original standard IEC 60191-6-10-2003 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices - Part 6-12- General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA). IEC 60191-6-12:2011. Original standard IEC 60191-6-12-2011 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices - Part 6-13- Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). IEC 60191-6-13:2016-09(en-fr). Original standard IEC 60191-6-13-2016 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices - Part 6-16- Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA. IEC 60191-6-16:2007. Original standard IEC 60191-6-16-2007 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices - Part 6-17- General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA). IEC 60191-6-17:2011. Original standard IEC 60191-6-17-2011 in PDF full version. Additional info + preview on request
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Mechanical standardization of semiconductor devices - Part 6-18- General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA). IEC 60191-6-18:2010. Original standard IEC 60191-6-18-2010 in PDF full version. Additional info + preview on request
Document status: Active