Moldova standards PDF

St IEC 60191-6-18-2010 cor1-2010

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA). Original standard IEC 60191-6-18-2010 cor1-2010 in PDF full version. Additional info + preview on request

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St IEC 60191-6-18-2010 cor2-2010

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA). Original standard IEC 60191-6-18-2010 cor2-2010 in PDF full version. Additional info + preview on request

Document status: Active

€15
St IEC 60191-6-19-2010

Mechanical standardization of semiconductor devices - Part 6-19- Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage. IEC 60191-6-19:2010. Original standard IEC 60191-6-19-2010 in PDF full version. Additional info + preview on request

Document status: Active

€35
St IEC 60191-6-2-2001

Mechanical standardization of semiconductor devices - Part 6-2- General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages. IEC 60191-6-2:2001. Original standard IEC 60191-6-2-2001 in PDF full version. Additional info + preview on request

Document status: Active

€35
St IEC 60191-6-2-2001 cor1-2002

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages. Original standard IEC 60191-6-2-2001 cor1-2002 in PDF full version. Additional info + preview on request

Document status: Active

€35
St IEC 60191-6-20-2010

Mechanical standardization of semiconductor devices - Part 6-20- General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ). IEC 60191-6-20:2010. Original standard IEC 60191-6-20-2010 in PDF full version. Additional info + preview on request

Document status: Active

€35