Moldova standards PDF

Mechanical standardization of semiconductor devices - Part 6-6- General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA). IEC 60191-6-6:2001. Original standard IEC 60191-6-6-2001 in PDF full version. Additional info + preview on request

Document status: Active

Mechanical standardization of semiconductor devices - Part 6-8- General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP). IEC 60191-6-8:2001. Original standard IEC 60191-6-8-2001 in PDF full version. Additional info + preview on request

Document status: Active

Low-pressure sodium vapour lamps - Performance specifications. CEI/IEC 60192:2001. Original standard IEC 60192-2001 in PDF full version. Additional info + preview on request

Document status: Active

Hydraulic turbines, storage pumps and pump-turbines - Model acceptance tests. IEC 60193:2019-04(en-fr). Original standard IEC 60193-2019 in PDF full version. Additional info + preview on request

Document status: Active

Printed boards design, manufacture and assembly - Vocabulary - Part 1- Common usage in printed board and electronic assembly technologies. IEC 60194-1:2021-02(en-fr). Original standard IEC 60194-1-2021 in PDF full version. Additional info + preview on request

Document status: Active

Electronic assembly, design and circuit boards - Vocabulary - Part 2- Common usage in electronic technologies as well as electronic assembly technologies. IEC 60194-2:2025-02(en). Original standard IEC 60194-2-2025 in PDF full version. Additional info + preview on request

Document status: Active