Moldova standards PDF
Semiconductor devices - Mechanical and climatic test methods - Part 2- Low air pressure. CEI/IEC 60749-2:2002. Original standard IEC 60749-2-2002 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure. Original standard IEC 60749-2-2002 сor1-2003 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices - Mechanical and climatic test methods - Part 20-1- Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat. IEC 60749-20-1:2019-06(en-fr). Original standard IEC 60749-20-1-2019 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices - Mechanical and climatic test methods - Part 20- Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat. IEC 60749-20:2020-08(en-fr). Original standard IEC 60749-20-2020 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices - Mechanical and climatic test methods - Part 21- Solderability. IEC 60749-21:2011. Original standard IEC 60749-21-2011 in PDF full version. Additional info + preview on request
Document status: Replaced by St IEC 60749-21-2025
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength. Original standard IEC 60749-22-2002 сor1-2003 in PDF full version. Additional info + preview on request
Document status: Active