Moldova standards PDF

Printed boards and printed board assemblies - Design and use - Part 5-2- Attachment (land joint) considerations - Discrete components. IEC 61188-5-2:2003. Original standard IEC 61188-5-2-2003 in PDF full version. Additional info + preview on request

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Printed boards and printed board assemblies - Design and use - Part 5-3- Attachment (land joint) considerations - Components with gull-wing leads on two sides. IEC 61188-5-3:2007. Original standard IEC 61188-5-3-2007 in PDF full version. Additional info + preview on request

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Printed boards and printed board assemblies - Design and use - Part 5-4- Attachment (land joint) considerations - Components with J leads on two sides. IEC 61188-5-4:2007. Original standard IEC 61188-5-4-2007 in PDF full version. Additional info + preview on request

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Printed boards and printed board assemblies - Design and use - Part 5-5- Attachment (land joint) considerations - Components with gull-wing leads on four sides. IEC 61188-5-5:2007. Original standard IEC 61188-5-5-2007 in PDF full version. Additional info + preview on request

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Printed boards and printed board assemblies - Design and use - Part 5-6- Attachment (land joint) considerations - Chip carriers with J-leads on four sides. CEI/IEC 61188-5-6:2003. Original standard IEC 61188-5-6-2003 in PDF full version. Additional info + preview on request

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Printed board and printed board assemblies - Design and use - Part 5-8- Attachment (land joint) considerations - Area array components (BGA, FBGA, CGA, LGA). IEC 61188-5-8:2007. Original standard IEC 61188-5-8-2007 in PDF full version. Additional info + preview on request

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