Moldova standards PDF

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St IEC 61189-2-721-2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721- Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator. IEC 61189-2-721:2015-04(en-fr). Original standard IEC 61189-2-721-2015 in PDF full version. Additional info + preview on request

Document status: Active

€35
St IEC 61189-2-801-2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801- Thermal conductivity test for base materials. IEC 61189-2-801:2023-07(en-fr). Original standard IEC 61189-2-801-2023 in PDF full version. Additional info + preview on request

Document status: Active

€35
St IEC 61189-2-803-2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803- Test methods for Z-axis expansion of base materials and printed boards. IEC 61189-2-803:2023-07(en-fr). Original standard IEC 61189-2-803-2023 in PDF full version. Additional info + preview on request

Document status: Active

€35
St IEC 61189-2-804-2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804- Test methods for time to delamination - T260, T288, T300. IEC 61189-2-804:2023-08(en-fr). Original standard IEC 61189-2-804-2023 in PDF full version. Additional info + preview on request

Document status: Active

€35
St IEC 61189-2-805-2024

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805- X Y CTE test for thin base materials by TMA. IEC 61189-2-805:2024-04(en-fr). Original standard IEC 61189-2-805-2024 in PDF full version. Additional info + preview on request

Document status: Active

€35
St IEC 61189-2-807-2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807- Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA. IEC 61189-2-807:2021-09(en-fr). Original standard IEC 61189-2-807-2021 in PDF full version. Additional info + preview on request

Document status: Active

€35
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