Moldova standards PDF

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St IEC 61189-5-502-2021

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502- General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies. IEC 61189-5-502:2021-02(en-fr). Original standard IEC 61189-5-502-2021 in PDF full version. Additional info + preview on request

Document status: Active

€35
St IEC 61189-5-503-2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503- General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards. IEC 61189-5-503:2017-05(en-fr). Original standard IEC 61189-5-503-2017 in PDF full version. Additional info + preview on request

Document status: Active

€35
St IEC 61189-5-504-2020

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-504- General test methods for materials and assemblies - Process ionic contamination testing (PICT). IEC 61189-5-504:2020-04(en-fr). Original standard IEC 61189-5-504-2020 in PDF full version. Additional info + preview on request

Document status: Active

€35
St IEC 61189-5-601-2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601- General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards. IEC 61189-5-601:2021-02(en-fr). Original standard IEC 61189-5-601-2021 in PDF full version. Additional info + preview on request

Document status: Active

€35
St IEC 61189-6-2006

Test methods for electrical materials, interconnection structures and assemblies - Part 6- Test methods for materials used in manufacturing electronic assemblies. IEC 61189-6:2006. Original standard IEC 61189-6-2006 in PDF full version. Additional info + preview on request

Document status: Withdrawn

€35
St IEC 61190-1-1-2002

Attachment materials for electronic assembly - Part 1-1- Requirements for soldering fluxes for high-quality interconnections in electronics assembly. CEI/IEC 61190-1-1:2002. Original standard IEC 61190-1-1-2002 in PDF full version. Additional info + preview on request

Document status: Active

€35
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