Moldova standards PDF

Attachment materials for electronic assembly - Part 1-2- Requirements for soldering pastes for high-quality interconnects in electronics assembly. IEC 61190-1-2:2014-02(en-fr). Original standard IEC 61190-1-2-2014 in PDF full version. Additional info + preview on request

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Attachment materials for electronic assembly - Part 1-3- Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications. IEC 61190-1-3:2017-12(en-fr). Original standard IEC 61190-1-3-2017 in PDF full version. Additional info + preview on request

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Printed board assemblies - Part 1- Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies. IEC 61191-1:2018-09(en-fr). Original standard IEC 61191-1-2018 in PDF full version. Additional info + preview on request

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Printed board assemblies - Part 2- Sectional specification - Requirements for surface mount soldered assemblies. IEC 61191-2:2017-05(en-fr). Original standard IEC 61191-2-2017 in PDF full version. Additional info + preview on request

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Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies. IEC 61191-2:2017-05/COR1:2019-09(en). Original standard IEC 61191-2-2017 cor1-2019 in PDF full version. Additional info + preview on request

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Printed board assemblies - Part 3- Sectional specification - Requirements for through-hole mount soldered assemblies. IEC 61191-3:2017-05(en-fr). Original standard IEC 61191-3-2017 in PDF full version. Additional info + preview on request

Document status: Active