Moldova standards PDF
Materials for printed boards and other interconnecting structures - Part 2-44- Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly. IEC 61249-2-44:2016-05(en-fr). Original standard IEC 61249-2-44-2016 in PDF full version. Additional info + preview on request
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Materials for printed boards and other interconnecting structures - Part 2-45- Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W (m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly. IEC 61249-2-45:2018-01(en-fr). Original standard IEC 61249-2-45-2018 in PDF full version. Additional info + preview on request
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Materials for printed boards and other interconnecting structures - Part 2-46- Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W (m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly. IEC 61249-2-46:2018-01(en-fr). Original standard IEC 61249-2-46-2018 in PDF full version. Additional info + preview on request
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Materials for printed boards and other interconnecting structures - Part 2-47- Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W (m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly. IEC 61249-2-47:2018-01(en). Original standard IEC 61249-2-47-2018 in PDF full version. Additional info + preview on request
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Materials for printed boards and other interconnecting structures - Part 2-5- Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad. CEI/IEC 61249-2-5:2003. Original standard IEC 61249-2-5-2003 in PDF full version. Additional info + preview on request
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Materials for printed boards and other interconnecting structures - Part 2-51- Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad. IEC 61249-2-51:2023-05(en-fr). Original standard IEC 61249-2-51-2023 in PDF full version. Additional info + preview on request
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