Moldova standards PDF
Semiconductor devices - Micro-electromechanical devices - Part 13- Bend - and shear - type test methods of measuring adhesive strength for MEMS structures. IEC 62047-13:2012. Original standard IEC 62047-13-2012 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices - Micro-electromechanical devices - Part 14- Forming limit measuring method of metallic film materials. IEC 62047-14:2012. Original standard IEC 62047-14-2012 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices - Micro-electromechanical devices - Part 15- Test method of bonding strength between PDMS and glass. IEC 62047-15:2015-03(en-fr). Original standard IEC 62047-15-2015 in PDF full version. Additional info + preview on request
Document status: Withdrawn
Semiconductor devices - Micro-electromechanical devices - Part 16- Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods. IEC 62047-16:2015-03(en-fr). Original standard IEC 62047-16-2015 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices - Micro-electromechanical devices - Part 17- Bulge test method for measuring mechanical properties of thin films. IEC 62047-17:2015-03(en-fr). Original standard IEC 62047-17-2015 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices - Micro-electromechanical devices - Part 18- Bend testing methods of thin film materials. IEC 62047-18:2013. Original standard IEC 62047-18-2013 in PDF full version. Additional info + preview on request
Document status: Active