Moldova standards PDF

Semiconductor devices - Micro-electromechanical devices - Part 26- Description and measurement methods for micro trench and needle structures. IEC 62047-26:2016-01(en-fr). Original standard IEC 62047-26-2016 in PDF full version. Additional info + preview on request

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Semiconductor devices - Micro-electromechanical devices - Part 27- Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT). IEC 62047-27:2017-01(en). Original standard IEC 62047-27-2017 in PDF full version. Additional info + preview on request

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Semiconductor devices - Micro-electromechanical devices - Part 28- Performance testing method of vibration-driven MEMS electret energy harvesting devices. IEC 62047-28:2017-01(en). Original standard IEC 62047-28-2017 in PDF full version. Additional info + preview on request

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Semiconductor devices - Micro-electromechanical devices - Part 29- Electromechanical relaxation test method for freestanding conductive thin-films under room temperature. IEC 62047-29:2017-11(en). Original standard IEC 62047-29-2017 in PDF full version. Additional info + preview on request

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Semiconductor devices - Micro-electromechanical devices - Part 3- Thin film standard test piece for tensile testing. CEI/IEC 62047-3:2006. Original standard IEC 62047-3-2006 in PDF full version. Additional info + preview on request

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Semiconductor devices - Micro-electromechanical devices - Part 30- Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film. IEC 62047-30:2017-09(en). Original standard IEC 62047-30-2017 in PDF full version. Additional info + preview on request

Document status: Active