Moldova standards PDF
Semiconductor devices - Micro-electromechanical devices - Part 37- Environmental test methods of MEMS piezoelectric thin films for sensor application. IEC 62047-37:2020-04(en-fr). Original standard IEC 62047-37-2020 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices - Micro-electromechanical devices - Part 38- Test method for adhesion strength of metal powder paste in MEMS interconnection. IEC 62047-38:2021-06(en). Original standard IEC 62047-38-2021 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices - Micro-electromechanical devices - Part 4- Generic specification for MEMS. IEC 62047-4:2008. Original standard IEC 62047-4-2008 in PDF full version. Additional info + preview on request
Document status: Replaced by St IEC 62047-4-2026
Semiconductor devices - Micro-electromechanical devices - Part 40-Test methods of micro-electromechanical inertial shock switch threshold. IEC 62047-40:2021-09(en). Original standard IEC 62047-40-2021 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices - Micro-electromechanical devices - Part 41- RF MEMS circulators and isolators. IEC 62047-41:2021-06(en-fr). Original standard IEC 62047-41-2021 in PDF full version. Additional info + preview on request
Document status: Active
Semiconductor devices - Micro-electromechanical devices - Part 42- Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever. IEC 62047-42:2022-09(en). Original standard IEC 62047-42-2022 in PDF full version. Additional info + preview on request
Document status: Active