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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801- Thermal conductivity test for base materials. IEC 61189-2-801:2023-07(en-fr). Original standard IEC 61189-2-801-2023 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803- Test methods for Z-axis expansion of base materials and printed boards. IEC 61189-2-803:2023-07(en-fr). Original standard IEC 61189-2-803-2023 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804- Test methods for time to delamination - T260, T288, T300. IEC 61189-2-804:2023-08(en-fr). Original standard IEC 61189-2-804-2023 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805- X Y CTE test for thin base materials by TMA. IEC 61189-2-805:2024-04(en-fr). Original standard IEC 61189-2-805-2024 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807- Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA. IEC 61189-2-807:2021-09(en-fr). Original standard IEC 61189-2-807-2021 in PDF full version. Additional info + preview on request

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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808- Thermal resistance of an assembly by thermal transient method. IEC 61189-2-808:2024-04(en-fr). Original standard IEC 61189-2-808-2024 in PDF full version. Additional info + preview on request

Document status: Active