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Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809- X Y coefficient of thermal expansion (CTE) test for thick base materials by TMA. IEC 61189-2-809:2024-12. Original standard IEC 61189-2-809-2024 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3- Test methods for interconnection structures (printed boards). IEC 61189-3:2007. Original standard IEC 61189-3-2007 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719- Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling. IEC 61189-3-719:2016-01(en-fr). Original standard IEC 61189-3-719-2016 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913- Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs. IEC 61189-3-913:2016-01(en-fr). Original standard IEC 61189-3-913-2016 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1- General test methods for materials and assemblies - Guidance for printed board assemblies. IEC 61189-5-1:2016-07(en-fr). Original standard IEC 61189-5-1-2016 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2- General test methods for materials and assemblies - Soldering flux for printed board assemblies. IEC 61189-5-2:2015-01(en-fr). Original standard IEC 61189-5-2-2015 in PDF full version. Additional info + preview on request
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