STM PDF

Printed board assemblies - Part 6- Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method. IEC 61191-6:2010. Original standard IEC 61191-6-2010 in PDF full version. Additional info + preview on request

Document status: Active

Workmanship requirements for soldered electronic assemblies - Part 1- General. IEC 61192-1:2003. Original standard IEC 61192-1-2003 in PDF full version. Additional info + preview on request

Document status: Withdrawn

Workmanship requirements for soldered electronic assemblies - Part 2- Surface-mount assemblies. IEC 61192-2:2003. Original standard IEC 61192-2-2003 in PDF full version. Additional info + preview on request

Document status: Withdrawn

Workmanship requirements for soldered electronic assemblies - Part 3- Through-hole mount assemblies. IEC 61192-3:2002. Original standard IEC 61192-3-2002 in PDF full version. Additional info + preview on request

Document status: Withdrawn

Workmanship requirements for soldered electronic assemblies - Part 4- Terminal assemblies. IEC 61192-4:2002. Original standard IEC 61192-4-2002 in PDF full version. Additional info + preview on request

Document status: Withdrawn

Workmanship requirements for soldered electronic assemblies - Part 5- Rework, modification and repair of soldered electronic assemblies. IEC 61192-5:2007. Original standard IEC 61192-5-2007 in PDF full version. Additional info + preview on request

Document status: Withdrawn