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Information technology. Use of X.25 packet layer protocol in conjunction with X.21/X.21bis to provide the OSI connection-mode Network Service

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Mounting of electric radioelectronic equipment and instruments. Technical requirements for mounting of connectors ShR, ShR, ShRG

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Digital video broadcasting. Multimedia home platform. Classes 1.2. Basic parameters

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Workmanship requirements for soldered electronic assemblies. Part 3. Through-hole mount assemblies

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Informational ensuring of equipment and operational activity. Language of operation activity. Morphology

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Fixed capacitors for use in electronic equipment. Part 11. Blanc detail specification. Fixed polyethylene-terephthalate film dielectric metal foil d.c. capacitors. Assessment level E

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