STB PDF
Surface mounting technology - Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method. Original standard PD IEC TR 61760-3-1-2022 in PDF full version. Additional info + preview on request
Document status: Active
Surface mounting technology - Surface strain on circuit board. Strain gauge measurement applied to chip components. Original standard PD IEC TR 61760-5-1-2024 in PDF full version. Additional info + preview on request
Document status: Active
Overhead lines. Meteorological data for assessing climatic loads. Original standard PD IEC TR 61774-1997 (2002) in PDF full version. Additional info + preview on request
Document status: Active
Superconductivity - Superconducting wires. Categories of practical superconducting wires. General characteristics and guidance. Original standard PD IEC TR 61788-20-2014 in PDF full version. Additional info + preview on request
Document status: Active
Function blocks (FB) for process control. Electronic device description language (EDDL) - Meeting the requirements for integrating fieldbus devices in engineering tools for field devices. Original standard PD IEC TR 61804-6-2012 in PDF full version. Additional info + preview on request
Document status: Active
On-line analyser systems. Guide to design and installation. Original standard PD IEC TR 61831-2011 in PDF full version. Additional info + preview on request
Document status: Active