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Circuit boards and circuit board assemblies. Design and use - Land pattern design. Description of land pattern for through hole components (THT). Original standard UNE-EN IEC 61188-6-3-2025 in PDF full version. Additional info + preview on request
Document status: Active
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA. Original standard UNE-EN IEC 61189-2-809-2025 in PDF full version. Additional info + preview on request
Document status: Active
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Detection of plating defects in unpopulated circuit boards by computed tomography (CT). Original standard UNE-EN IEC 61189-3-302-2025 in PDF full version. Additional info + preview on request
Document status: Active
Materials for printed boards and other interconnecting structures - Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad. Original standard UNE-EN IEC 61249-2-53-2025 in PDF full version. Additional info + preview on request
Document status: Active
Electroacoustics - Personal sound exposure meters. Original standard UNE-EN IEC 61252-2025 in PDF full version. Additional info + preview on request
Document status: Active
Fibre optic interconnecting devices and passive components. Basic test and measurement procedures - Tests. Axial compression. Original standard UNE-EN IEC 61300-2-11-2024 in PDF full version. Additional info + preview on request
Document status: Active