Moldova standards PDF
Semiconductor devices - Micro-electromechanical devices - Part 43- Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices. IEC 62047-43:2024-03(en). Original standard IEC 62047-43-2024 in PDF full version. Additional info + preview on request
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Semiconductor devices - Micro-electromechanical devices - Part 44- Test methods for dynamic performances of MEMS resonant electric-field-sensitive devices. IEC 62047-44:2024-02(en). Original standard IEC 62047-44-2024 in PDF full version. Additional info + preview on request
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Semiconductor devices - Micro-electromechanical devices - Part 45- Silicon based MEMS fabrication technology - Measurement method of impact resistance of nanostructures. IEC 62047-45:2025-03. Original standard IEC 62047-45-2025 in PDF full version. Additional info + preview on request
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Semiconductor devices - Micro-electromechanical devices - Part 46- Silicon based MEMS fabrication technology - Measurement method of tensile strength of nanoscale thickness membrane. IEC 62047-46:2025-04. Original standard IEC 62047-46-2025 in PDF full version. Additional info + preview on request
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Semiconductor devices - Micro-electromechanical devices - Part 47- Silicon based MEMS fabrication technology - Measurement method of bending strength of microstructures. IEC 62047-47:2024-08. Original standard IEC 62047-47-2024 in PDF full version. Additional info + preview on request
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Semiconductor devices - Micro-electromechanical devices - Part 48- Test method for determining solution concentration by optical absorption using MEMS fluidic device. IEC 62047-48:2024-06(en). Original standard IEC 62047-48-2024 in PDF full version. Additional info + preview on request
Document status: Active