Moldova standards PDF

Semiconductor devices - Micro-electromechanical devices - Part 9- Wafer to wafer bonding strength measurement for MEMS. IEC 62047-9:2011. Original standard IEC 62047-9-2011 in PDF full version. Additional info + preview on request

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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9- Wafer to wafer bonding strength measurement for MEMS. Original standard IEC 62047-9-2011 cor1-2012 in PDF full version. Additional info + preview on request

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VHDL Register Transfer Level (RTL) synthesis. Original standard IEC 62050-2005 (IEEE 1076.6) in PDF full version. Additional info + preview on request

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Electricity metering equipment - General requirements, tests and test conditions - Part 11- Metering equipment. IEC 62052-11:2020-06(en). Original standard IEC 62052-11-2020 in PDF full version. Additional info + preview on request

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Corrigendum 1 - Amendment 1 - Electricity metering equipment (A.C.) - General requirements, tests and test conditions - Part 21: Tariff and load control equipment. IEC 62052-21:2004-05/AMD1:2016-11/COR1:2018-03(en-fr). Original standard IEC 62052-21-2004 amd1-2016 cor1-2018 in PDF full version. Additional info + preview on request

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Electricity metering equipment (a.c.) - General requirements, tests and test conditions - Part 21- Tariff and load control equipment. IEC 62052-21:2004-05+AMD1:2016-11 CSV(en-fr). Original standard IEC 62052-21-2016 in PDF full version. Additional info + preview on request

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