IEC 62047-9-2011 cor1-2012 PDF
Name in English:
St IEC 62047-9-2011 cor1-2012
Name in Russian:
Ст IEC 62047-9-2011 cor1-2012
Description in English:
Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9- Wafer to wafer bonding strength measurement for MEMS. Original standard IEC 62047-9-2011 cor1-2012 in PDF full version. Additional info + preview on request
Description in Russian:
Поправка 1 - Полупроводниковые приборы - Микроэлектромеханические устройства - Часть 9- Измерение прочности соединения между пластинами для MEMS. Оригинальный стандарт IEC 62047-9-2011 cor1-2012 в PDF полная версия. Дополнительная инфо + превью по запросу
Document status:
Active
Format:
Electronic (PDF)
Page count:
2
Delivery time (for English version):
1 business day
Delivery time (for Russian version):
2 business days
SKU:
stiec06352
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