STM PDF

Semiconductor devices - Mechanical and climatic test methods - Part 20-1- Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat. Original standard IEC 60749-20-1-2009 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-20-1-2019

Semiconductor devices - Mechanical and climatic test methods - Part 20- Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat. Original standard IEC 60749-20-2008 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-20-2020

Semiconductor devices - Mechanical and climatic test methods. Original standard IEC 60749-2002 in PDF full version. Additional info + preview on request

Document status: Replaced by

Semiconductor devices - Mechanical and climatic test methods - Part 28- Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level. Original standard IEC 60749-28-2017 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-28-2022

Semiconductor devices - Mechanical and climatic test methods - Part 30- Preconditioning of non-hermetic surface mount devices prior to reliability testing. Original standard IEC 60749-30-2011 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-30-2020

Semiconductor devices - Mechanical and climatic test methods - Part 37- Board level drop test method using an accelerometer. Original standard IEC 60749-37-2008 in PDF full version. Additional info + preview on request

Document status: Replaced by St IEC 60749-37-2022