ISO 26262-11-2018 PDF

Full title and description

St ISO 26262-11-2018 — Road vehicles — Functional safety — Part 11: Guidelines on application of ISO 26262 to semiconductors. Informative guidance that interprets and explains how to apply the ISO 26262 functional‑safety framework specifically to semiconductor components (ASICs, SoCs, memories, PLDs, analogue/mixed‑signal blocks, sensors, IP blocks and multi‑core devices) used in safety‑related E/E vehicle systems.

Abstract

This part of ISO 26262 provides non‑normative, semiconductor‑focused guidance intended to help manufacturers and suppliers integrate semiconductor development, verification and production activities into an ISO 26262 safety lifecycle. It addresses tailored lifecycle activities, failure and fault modelling for semiconductor technologies, dependent‑failure analysis, IP/black‑box integration, verification techniques such as fault injection, production and operation work products, and technology‑specific considerations. The document does not introduce new normative requirements; it offers interpretations and worked examples to support compliance with other parts of ISO 26262.

General information

• Status: Published (first edition); currently active but under review for revision.
• Publication date: 17 December 2018.
• Publisher: ISO (International Organization for Standardization).
• ICS / categories: 43.040.10 — Electrical and electronic equipment.
• Edition / version: Edition 1 (2018).
• Number of pages: 179 pages.

Scope

Applies to safety‑related systems that include one or more electrical and/or electronic (E/E) systems installed in series‑production road vehicles (excludes mopeds and special/unique E/E systems such as some driver‑assist adaptations). The guidance covers tailoring of the safety lifecycle for semiconductor development and integration, addresses hazards resulting from malfunctioning behaviour of safety‑related E/E systems (but not unrelated hazards such as fire or toxicity unless directly caused by E/E malfunction), and provides semiconductor‑specific interpretations and examples to help meet requirements elsewhere in ISO 26262. Systems or components already released for production prior to the publication date are treated with tailoring guidance for alterations and integrations.

Key topics and requirements

• Guidance for tailoring the ISO 26262 safety lifecycle to semiconductor development and supply chains (development interface agreements, supplier/OEM responsibilities).
• Semiconductor‑specific fault and failure models (including memories, digital blocks, analogue/mixed‑signal behaviour and technology failure mechanisms).
• Dependent Failure Analysis (DFA), common‑cause and cascading failure considerations for on‑chip and multi‑IP interactions.
• Qualitative and quantitative HW analyses (FMEA/FMEDA/FMEDA), base failure‑rate estimation and diagnostic coverage discussions.
• Techniques for verification and validation of safety mechanisms, including fault injection and confirmation measures.
• Integration of third‑party IP and black‑box components: partitioning, safety requirements allocation and verification evidence expectations.
• Production, operation and service work products relevant to semiconductor readiness and evidence for ASIL claims.
• Technology‑specific guidance (digital, memories, PLDs, analogue/mixed‑signal, sensors, multi‑core) and worked examples in informative annexes.

Typical use and users

Used by semiconductor design teams (ASIC/SoC/IP), functional safety engineers, system architects, verification and test teams, OEMs and Tier‑1 suppliers involved in ASIL determination and evidence generation, safety program managers, and quality/regulatory staff who must demonstrate alignment of semiconductor development with ISO 26262 safety objectives. Also used by consultants and auditors assessing semiconductor‑related safety work products.

Related standards

ISO 26262 (other parts — Parts 1–10, 12) — this document is a part of the ISO 26262 series; IEC 61508 (general functional safety principles); industry guidance on semiconductor reliability and radiation/single‑event effects (JEDEC and vendor whitepapers); national/adopted variants and translations (e.g., GB/T 34590.11). Organizations typically use ISO 26262‑11 alongside the normative parts of ISO 26262 (hardware and software development parts) and applicable automotive product standards.

Keywords

ISO 26262, functional safety, semiconductors, ASIC, SoC, FMEDA, fault injection, dependent failure analysis, diagnostic coverage, IP integration, ASIL, automotive safety, hardware safety guidance.

FAQ

Q: What is this standard?

A: ISO 26262‑11:2018 is Part 11 of the ISO 26262 series — an informative guideline explaining how to apply ISO 26262 principles to semiconductor components used in automotive safety‑related E/E systems.

Q: What does it cover?

A: It covers semiconductor‑specific interpretations of ISO 26262: tailoring the safety lifecycle for chips and IP, failure/fault models, DFA, FMEA/FMEDA, diagnostic coverage, fault injection and verification techniques, IP/black‑box integration, and production/operation work products; content is informative and intended to support compliance with the normative parts of ISO 26262.

Q: Who typically uses it?

A: Semiconductor designers (ASIC/SoC/IP), functional safety and system engineers, OEMs and Tier‑1 suppliers, verification/test teams, safety managers, and auditors.

Q: Is it current or superseded?

A: The 2018 first edition (published 17 December 2018) remains the published edition; ISO shows a working draft (ISO/WD 26262‑11.2) in development to revise/replace the 2018 edition, so users should check for the finalized revision before relying on the older text for new projects.

Q: Is it part of a series?

A: Yes — it is Part 11 of the ISO 26262 series on automotive functional safety; it is complementary to the normative parts (e.g., Parts 1–10 and Part 12) and intended to be used together with those parts when addressing semiconductor‑related safety activities.

Q: What are the key keywords?

A: Semiconductor, functional safety, ISO 26262, ASIL, FMEDA, fault injection, diagnostic coverage, dependent failure analysis, IP integration, verification, production work products.