STB PDF

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STB PD IEC TS 62647-2-2012

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Mitigation of deleterious effects of tin. Original standard PD IEC TS 62647-2-2012 in PDF full version. Additional info + preview on request

Document status: Active

€50
STB PD IEC TS 62647-21-2013

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Program management. Systems engineering guidelines for managing the transition to lead-free electronics. Original standard PD IEC TS 62647-21-2013 in PDF full version. Additional info + preview on request

Document status: Active

€50
STB PD IEC TS 62647-22-2013

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Technical guidelines. Original standard PD IEC TS 62647-22-2013 in PDF full version. Additional info + preview on request

Document status: Active

€50
STB PD IEC TS 62647-23-2013

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies. Original standard PD IEC TS 62647-23-2013 in PDF full version. Additional info + preview on request

Document status: Active

€50
STB PD IEC TS 62647-3-2014

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Performance testing for systems containing lead-free solder and finishes. Original standard PD IEC TS 62647-3-2014 in PDF full version. Additional info + preview on request

Document status: Active

€50
STB PD IEC TS 62647-4-2018

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder - Ball grid array (BGA) re-balling. Original standard PD IEC TS 62647-4-2018 in PDF full version. Additional info + preview on request

Document status: Active

€50
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