Moldova standards PDF

Semiconductor devices - Mechanical and climatic test methods - Part 14- Robustness of terminations (lead integrity). IEC 60749-14:2003. Original standard IEC 60749-14-2003 in PDF full version. Additional info + preview on request

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Semiconductor devices - Mechanical and climatic test methods - Part 15- Resistance to soldering temperature for through-hole mounted devices. IEC 60749-15:2020-07(en-fr). Original standard IEC 60749-15-2020 in PDF full version. Additional info + preview on request

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Semiconductor devices - Mechanical and climatic test methods - Part 16- Particle impact noise detection (PIND). CEI/IEC 60749-16:2003. Original standard IEC 60749-16-2003 in PDF full version. Additional info + preview on request

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Semiconductor devices - Mechanical and climatic test methods - Part 17- Neutron irradiation. IEC 60749-17:2019-03(en-fr). Original standard IEC 60749-17-2019 in PDF full version. Additional info + preview on request

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Semiconductor devices - Mechanical and climatic test methods - Part 18- Ionizing radiation (total dose). IEC 60749-18:2019-04(en-fr). Original standard IEC 60749-18-2019 in PDF full version. Additional info + preview on request

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Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19- Die shear strength. Original standard IEC 60749-19-2010 in PDF full version. Additional info + preview on request

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