Turkmenistan standards PDF

Sectional Design Standard for High Density Interconnect (HDI) Printed Boards. Original standard IPC 2226A-2017 in PDF full version. Additional info + preview on request

Document status: Active

Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards. Original standard IPC 2228-2022 in PDF full version. Additional info + preview on request

Document status: Active

DFX Guidelines. Original standard IPC 2231A-2021 in PDF full version. Additional info + preview on request

Document status: Active

Design Guide for the Packaging of High Speed Electronic Circuits. Original standard IPC 2251-2003 in PDF full version. Additional info + preview on request

Document status: Active

Design Guide for RF/Microwave Circuit Boards. Original standard IPC 2252-2002 in PDF full version. Additional info + preview on request

Document status: Replaced by St IPC 2228-2022

Design Standard for Printed Electronics on Flexible Substrates. Original standard IPC 2292A-2022 in PDF full version. Additional info + preview on request

Document status: Active