Turkmenistan standards PDF

Specification for Immersion Tin Plating for Printed Circuit Boards — With Amendment 1. Original standard IPC 4554-2012 in PDF full version. Additional info + preview on request

Document status: Active

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards. Original standard IPC 4555-2022 in PDF full version. Additional info + preview on request

Document status: Active

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards. Original standard IPC 4556-2013 in PDF full version. Additional info + preview on request

Document status: Replaced by

Metal Foil for Printed Board Applications — With Amendment 1. Original standard IPC 4562A-WAM1-2016 in PDF full version. Additional info + preview on request

Document status: Replaced by St IPC 4562B-2023

Metal Foil for Printed Board Applications. Original standard IPC 4562B-2023 in PDF full version. Additional info + preview on request

Document status: Active

Resin Coated Copper Foil for Printed Boards Guideline. Original standard IPC 4563-2007 in PDF full version. Additional info + preview on request

Document status: Active