Turkmenistan standards PDF

Design Guide for High Density Interconnects (HDI) and Microvias. Original standard IPC JPCA 2315-2000 in PDF full version. Additional info + preview on request

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Specification for High Density Interconnect (HDI) and Microvia Materials. Original standard IPC JPCA 4104-1999 in PDF full version. Additional info + preview on request

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Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards. Original standard IPC JPCA 6202-1999 in PDF full version. Additional info + preview on request

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Terms and Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards. Original standard IPC JPCA 6801-2000 in PDF full version. Additional info + preview on request

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Application Categories for Printed Electronics. Original standard IPC JPCA 6901-2015 in PDF full version. Additional info + preview on request

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Implementation of Flip Chip and Chip Scale Technology. Original standard IPC J-STD-012-1996 in PDF full version. Additional info + preview on request

Document status: Replaced by