STM PDF

Printed board and printed board assemblies - Design and use - Part 5-8- Attachment (land joint) considerations - Area array components (BGA, FBGA, CGA, LGA). IEC 61188-5-8-2007. Original standard IEC 61188-5-8-2007 in PDF full version. Additional info + preview on request

Document status: Active

Circuit boards and circuit board assemblies - Design and use - Part 6-1- Land pattern design - Generic requirements for land pattern on circuit boards. IEC 61188-6-1-2021-02(en-fr). Original standard IEC 61188-6-1-2021 in PDF full version. Additional info + preview on request

Document status: Active

Circuit boards and circuit board assemblies - Design and use - Part 6-2- Land pattern design - Description of land pattern for the most common surface mounted components (SMD). IEC 61188-6-2-2021-02(en-fr). Original standard IEC 61188-6-2-2021 in PDF full version. Additional info + preview on request

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Circuit boards and circuit board assemblies - Design and use - Part 6-3- Land pattern design - Description of land pattern for through hole components (THT). IEC 61188-6-3-2024-12. Original standard IEC 61188-6-3-2024 in PDF full version. Additional info + preview on request

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Printed boards and printed board assemblies - Design and use - Part 6-4- Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design. IEC 61188-6-4-2019-05(en-fr). Original standard IEC 61188-6-4-2019 in PDF full version. Additional info + preview on request

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Printed boards and printed board assemblies - Design and use - Part 7- Electronic component zero orientation for CAD library construction. IEC 61188-7-2017-04(en-fr). Original standard IEC 61188-7-2017 in PDF full version. Additional info + preview on request

Document status: Active