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Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1- General test methods and methodology. Original standard IEC 61189-1-2001 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11- Measurement of melting temperature or melting temperature ranges of solder alloys. IEC 61189-11-2013. Original standard IEC 61189-11-2013 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2- Test methods for materials for interconnection structures. IEC 61189-2-2006. Original standard IEC 61189-2-2006 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501- Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials. Original standard IEC 61189-2-501-2022 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630- Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning. IEC 61189-2-630-2018-06(en-fr). Original standard IEC 61189-2-630-2018 in PDF full version. Additional info + preview on request
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719- Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz). IEC 61189-2-719-2016-07(en-fr). Original standard IEC 61189-2-719-2016 in PDF full version. Additional info + preview on request
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